Mei-Ho Meihe Enterprise Co., Ltd.
Mei-Ho Meihe Enterprise Co., Ltd. established the PCB Abrasive Materials Business Unit in 2008 and cooperated with Nikken Japan Research Paper Co., Ltd. to develop abrasive materials for HDI/IC/FC high-order carrier plates. In 2012, it established a subsidiary company in Dongguan City, the United States. Research Optoelectronics Co., Ltd., FPC Soft Board Division, Wafer Semiconductor Business Unit, Mei-Ho has so far spanned many industries, and its services include the development and sales of precision grinding machine tools, electronics, wafer grinding materials, and optoelectronic materials. Main products are: grinding equipment, ceramic & non-woven brush wheel, laminated steel plate, burned iron plate, enamel aluminum foil, silicone pad, vacuum balloon, glass fiber cloth, wafer grinding wheel and so on.

 

ADD3F.,No.112,Sec.1,Zhong Cheng Rd.,Shilin Dist.,Taipei City 11148,TaiwanTEL+886-2-2833-2585FAX+886-2-2833-2580
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